Manho Lee,
Jun So Pak,
Joungho Kim
Electrical Design of Through Silicon Via
Gebonden Engels 2014 2014e druk 9789401790376
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Specificaties
ISBN13:9789401790376
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:280
Uitgever:Springer Netherlands
Druk:2014
Lezersrecensies
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Inhoudsopgave
<p>Preface.- 1 Introduction.- 2 Electrical Modeling of a Through-Silicon Via (TSV).- 3 High-speed TSV-based Channel Modeling and Design.- 4 Noise Coupling and Shielding in 3D ICs.- 5 Thermal Effects on TSV Signal Integrity.- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain.- 7 TSV Decoupling Schemes.- Index.</p>
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